MIL-PRF-28750F
APPENDIX B
B.3.2.1 Sequence of testing. The preferred tests identified by tables B-II, B-III, and B-IV identify various subgroups
of tests and within those subgroups a sequence of tests. The subgroups may be performed in any sequence,
individual testing within a subgroup shall be performed in the sequence indicated. The manufacturer may use
alternative systems provided they are approved as specified in B.3.1.2.
B.3.2.2 Protection from electrostatic discharge. For elements and SSR's that are sensitive to electrostatic
discharge, handling precautions and grounding procedures shall be taken to protect the elements and SSR's from
accidental damage.
B.3.3 Element evaluation.
B.3.3.1 General.
B.3.3.1.1 Element. Herein, "element" refers to materials for SSR assembly. Before SSR assembly, element
characteristics shall be evaluated to assure their compatibility with SSR requirements and assembly procedures (see
table B-I).
B.3.3.1.2 Characteristics. Characteristics to be verified shall be those necessary for compatibility with the element
specification and assembly procedures, and at least those which cannot be verified after assembly but could cause
functional failure of the SSR.
B.3.3.1.3 Location of element evaluation. Element evaluation may be performed at either the element supplier or
SSR manufacturing facility.
B.3.3.2 Evaluation of microcircuit and semiconductor dice. Microcircuit and semiconductor die shall be evaluated
as specified in B.3.3.2.1 through B.3.3.2.3. The manufacturer may use alternative evaluation systems provided they
are approved as specified in the electrical test specifications.
B.3.3.2.1 Electrical test specifications. Electrical test parameter, values, limits (including deltas), and conditions
shall be as specified in the microcircuit or semiconductor dice detail specification.
B.3.3.2.2 Die evaluation. Evaluation of the die shall include electrical and visual evaluation of the die as well as an
evaluation of assembled die. The electrical and visual evaluation of the semiconductor are not required if the die is a
JANCHC or JANCKC die tested in accordance with MIL-PRF-19500, appendix H. Electrical and visual evaluation of
the microcircuit die is not required for MIL-PRF-38535 qualified die.
B.3.3.2.2.1 Electrical testing. Each die shall be electrically tested (100 percent of the lot), which may be done at
the wafer level provided all failures are identified and removed from the lot when the dice are separated from the
wafer. The requirements shall be specified by the manufacturer for compliance with the die specifications.
B.3.3.2.2.2 Visual inspection. Each die shall be visually inspected to assure conformance with the applicable die
B.3.3.2.3 Assembled die evaluation. From each wafer lot, a sample shall be evaluated in accordance with table B-
II and B.3.3.2.3.1 through B.3.3.2.3.2. Each sample shall be assembled into suitable packages that simulate the
assembly methods and functional conditions of the element within the intended application.
B.3.3.2.3.1 Subgroup 1 and subgroup 2.
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