MIL-PRF-28750F
APPENDIX B
B.3.3.4.4.1 Subgroup 1. A minimum of five samples shall be submitted to subgroup 1 testing.
B.3.3.4.4.1.1 Physical dimension. Inspect in accordance with MIL-STD-883, method 2016 and the applicable
substrate detail specification.
B.3.3.4.4.1.2 Visual inspection. Inspect in accordance with MIL-STD-883, method 2032, and the applicable
substrate detail specification.
TABLE B-IV. Assembled substrate evaluation requirements.
Quantity
Reference
Subgroup
Test
Method
Condition
(accept no.)
paragraph
1
Physical dimension
2016
As applicable
5 (0)
Visual inspection
2032
As applicable
Electrical
2
Conductor thickness or
3 (1)
conductor resistivity
Film adhesion
Solderability
3
Temperature coefficient
2(0)
of resistance
Wire bond evaluation
2011
10 (0) wires
Die sheer evaluation
or
2019
20(1) wires
2 (0)
B.3.3.4.4.1.3 Electrical. Substrates shall be electrically tested at 25C for the following characteristics (minimum).
Requirements shall be as specified in the applicable substrate detail specification.
a.
Resistors: DC resistance.
b.
Capacitors: Capacitance. If specified in the applicable substrate detail specification, test for DWV,
insulation resistance, and dissipation factor.
c.
For multilayered substrates, continuity and isolation testing shall be performed to verify the interconnection
of conductors as specified in the applicable substrate detail specification.
B.3.3.4.4.2 Subgroup 2. A minimum of three samples that have been subjected to, and passed, subgroup 1
testing shall be submitted to subgroup 2 testing.
B.3.3.4.4.2.1 Conductor thickness. Measure conductor thickness in accordance with the applicable substrate
detail specification. Conductor thickness shall meet the requirements specified in the applicable substrate detail
specification.
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