MIL-R-835168
3.8 Solderability (applicable to relays with solder terminals). When relays are tested as specified in 4.6.5, the dipped surface of solid wire-lead and pin terminals shall be at least 95 percent covered with a continuous new solder coating. The remaining 5 percent may contain only small pinholes or rough spots; these shall not be concentrated in one area. 8are base metal where the solder dip failed to cover the original coating is an indication of poor solderability, and shall be cause for failure. For solder-lug terminals greater than .045 inch (11.43 mm) in diameter, 95 percent of the total length of fillet, which is between the standard wrap wire and the terminal, shall be tangent to the surface of the terminal being tested, and shall be free of pinholes and voids. A ragged or interrupted line at the point of tangency between the fillet and the terminal under test shall be considered a failure.
3.9 Dielectric withstanding voltage. When tested as specified in 4.6.6, relays shall withstand the specified voltage (see 3.1) without damage. The leakage current shall not exceed 1 milliampere (mA) and there shall be no evidence of damage due to arcing (air discharge), flashover (surface discharge), or insulation breakdown (puncture discharge).
3.10 Insulation resistance. Unless otherwise specified (see 3.1), when relays are tested as specified in 4.6.7, the insulation resistance shall be not less than 10,000 megohms.
3.11 DC coil resistance. When relays are tested as specified in 4.6.8, the dc coil resistance shall be as specified
(see 3.1).
3.12 Coil transient suppression (applicable to relays with internal diodes). When relays are tested as specified in
4.6.9, the transient negative voltage shall not exceed the value specified (see 3.1).
3.13 Pickup and dropout voltages (as applicable, see 3.1). When relays are tested as specified in 4.6.10, the pickup and dropout voltages (as applicable) shall be as specified (see 3.1). (NOTE: Dropout voltage is not applicable to latching relays.)
3.14 Coil power dissipation (when specified, see 3.1). When relays are tested as specified in 4.6.11, the power dissipated shall be as specified (see 3.1).
3.15 Static contact resistance. When relays are tested as specified in 4.6.12, the static contact resistance (or voltage drop) of any pair of mated contacts shall not exceed 0.130 ohm before life, 1.0 ohm during life, and 1.0 ohm after life. For group A inspection, static contact resistance shall not exceed 0.200 ohm.
3.16 Operate and release times (as applicable see 3.1). When relays are tested as specified in 4.6.13, the operate and release times (as applicable) (including bounce) shall be as specified (see 3.1). (NOTE: Release time is not applicable to latching relays.)
3.17 Resistance to solvents. When relays are tested as specified in 4.6.14, the marking shall remain legible.
3.18 Contact noise (when specified, see 3.1). When relays are tested as specified in 4.6.15, the peak-to-peak ratings for the bandwidth (dc to 10 kilohertz (kHz)) shall be 400 microvolts (µV) at closure; 200 µV at 1.5 milliseconds (ms); 125 µV at 2 ms; 60 µV at 2.5 ms; 35 µV at 3 ms; 15 µV at 4 ms; and 10 µV at 5 ms.
3.19 Thermal EMF (when specified, see 3.1). When relays are tested as specified in 4.6.16, the thermal EMF shall be as specified (see 3.1).
3.20 Capacitance (when specified, see 3.1). When relays are tested as specified in 4.6.17, the capacitance shall be as specified (see 3.1).
3.21 Shock (specified pulse). When relays are tested as specified in 4.6.18, there shall be no evidence of mechanical or electrical damage.
3.22 Vibration, high frequency. When relays are tested as specified in 4.6.19, there shall be no evidence of breaking, cracking, chipping, or flaking of the finish, and no loosening of the terminals.
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