MIL-PRF-28750F
APPENDIX B
B.3.3.3 Passive elements.
B.3.3.3.1 Electrical test specifications. Electrical test parameters, values, limits, and conditions shall be as
specified in the passive element specification.
B.3.3.3.2 Evaluation of passive element lots. Evaluations of passive elements shall include electrical and visual
evaluation of the elements as well as an evaluation of assembled elements. The electrical and visual evaluation of
the element is not required if the element is an established reliability QPL or other QPL type device. The
manufacturer may use alternative evaluation systems provided they are approved as specified in B.3.1.2.
B.3.3.3.2.1 Electrical testing. Each passive element shall be 100 percent electrically tested at 25C, or as
specified in the passive element specification.
B.3.3.3.2.2 Visual inspection. Each passive element shall be 100 percent visually inspected to assure
conformance with the applicable passive element specification and the related requirements of MIL-STD-883, method
2032.
B.3.3.3.3 Assembled passive elements. From each inspection lot of passive elements, a randomly selected
a.
Each sample shall be assembled into suitable packages that simulate the assembly methods and functional
conditions of the element within the intended application.
b.
The sample shall contain at least 20 wire bonds (an equal number on each element) if the wire bonding
assembly is applicable.
B.3.3.3.3.1 Visual inspection (subgroup 1). Passive elements shall be visually inspected, using a sample of 22, to
assure conformance with the applicable passive element specification and MIL-STD-883, method 2032.
B.3.3.3.3.2 Electrical testing of passive elements (subgroup 2). Passive elements shall be electrically tested, using
a sample of 10, at 25C ± 5C for the following characteristics (minimum).
a.
Resistors: DC resistance.
b.
Ceramic type capacitors: DWV, insulation resistance, capacitance, and dissipation factor.
c.
Tantalum type capacitors: DC leakage current, capacitance, and dissipation factor.
d.
Inductors: DC resistance, inductance, and Q.
B.3.3.3.3.3 Wire bond strength testing (subgroup 3). The wire bond test only applies to passive elements when
wire bond assembly of passive elements is used to manufacture the SSR. The sample shall include at least 5
elements and 10 bond wires minimum.
a.
At least 10 wires, consisting of element to substrate and package bonds shall be destructively pull tested.
An equal number of bonds shall be tested on each sample element.
54
For Parts Inquires call Parts Hangar, Inc (727) 493-0744
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business