MIL-PRF-28750F
APPENDIX A
A.3.6.2 Qualifying activity approval. Approval of the solder dip process will be based on one of the following
options:
When the original lead finish qualified was hot solder dip in accordance with A.3.6.2b.(4). The manufacturer
a.
shall use the same solder dip process for retinning as is used in the original manufacture of the product.
b.
When the lead originally qualified was not hot solder dip as prescribed in A.3.6.2a, approval for the process
to be used for solder dip shall be based on the following test procedure:
(1)
Six samples of any SSR of an individual specification sheet and specific lead finish shall be subjected
to the manufacturer's solder dip process. Following the test, the SSR's shall be subjected to the A2
and A3 tests of the group A inspection, solder dip process, the relays are subjected to the group A
electricals. No process related (solder dip) defects are allowed.
(2)
Two of the six samples shall then be subjected to the solderability test. No defects are allowed.
(3)
The remaining four samples are subjected to the resistance to solder heat test and then to the A2 and
A3 tests of the group A inspection. No process related (solder dip) defects are allowed.
In addition, the hot solder dip process shall meet requirements of 6.7.5.
(4)
A.3.6.3 Solder dip/retinning options. The manufacturer may solder dip/retin as follows:
a.
After the group A, A1 screening tests. SSR's shall then be subjected to the remaining group A inspections.
b. As a corrective action, if the lot fails the group A solderability test, insulation resistance (all terminals to
case), seal, and visual/mechanical inspection shall be performed.
c.
After completion of group A inspection and following the solder dip/retinning process, an external visual
examination in accordance with A3 of group A shall be repeated.
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