MIL-PRF-28750F
b.
OFF state
1) Test setup in accordance with figure 1.
2) Apply the maximum load, voltage, and specified frequency (if applicable).
3) Apply specified (see 3.1) maximum input turn-off conditions.
4) Measure all currents and corresponding voltages and calculate the product of each. Calculate the
power dissipation by adding each product with the output voltage drop times output current, for each
output switch in addition to any power dissipated by internal power supplies.
5) Verify that the total power dissipation does not exceed the specified (see 3.1) limits.
4.7.7.26 Electromagnetic interference, 25 C only (see 3.13.32) (For qualification and Group C inspections only).
Solid state relays shall be subjected to electromagnetic interference as specified (see 3.1) in MIL-STD-461,table II
and method CE106. Maximum broadband conducted emission on power lines, with a resistive load at maximum
output voltage and current, during steady state and switching conditions, shall be within specifications (see 3.1).
4.7.8 Resistance to solvents (see 3.14). SSR's shall be tested in accordance with method 215 of MIL-STD-202 or
method 2015 of MIL-STD-883. The following details and exceptions shall apply:
a.
Portion to be brushed: All marking.
b.
Specimens to be tested: One specimen each for the four solutions.
c.
Examination: Specimens shall be examined for legibility of marking.
4.7.9 Shock (specified pulse) (see 3.15). SSR's shall be tested in accordance with MIL-STD-202, method 213.
The following details and exceptions shall apply:
Mounting method: As specified in 4.7.10b.
a.
b.
Test condition: F.
c.
Electrical power shall not be applied to the SSR during this test.
Measurements and examinations after shock: As specified in 4.7.10e.
d.
4.7.10 Vibration (see 3.16). SSR's shall be tested in accordance with MIL-STD-202, method 204. The following
details and exceptions shall apply:
a.
Tests and measurements prior to vibration: None.
b.
Method of mounting: Rigidly mounted by normal mounting means. SSR's designed for printed-circuit board
application shall be soldered by normal means to a printed-circuit board of any convenient size, which shall
in turn be secured by screws to a suitable fixture.
c.
Test condition: F, except 100 gravity units (g's) peak.
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