MIL-R-5757-SUP-2 Relays, Electromagnetic, General Specification forThis specification covers the general performance requirements for electrical relays with contact ratings up to and including 10 amperes for use in electronic, communications, and other applications see 6.1.

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MIL-R-5757J

3.4.5 Circuit diagram. The circuit diagram as specified (see 3.1), shall be a terminal view. Circuit symbols shall be in accordance with IEEE315 . For relays without an orientation tab, the circuit diagram, as specified (see 3.1), shall

be oriented so that when the relay is held with the circuit diagram right side up as shown (see 3.1), and rotated away

from the viewer about a horizontal axis through the diagram until the header terminals face the viewer, then each terminal shall be in the location shown in the circuit diagram.

3.4.6 Mounting means (see 3.1).

3.4.6.1 Bracket. Mounting brackets shall be an integral part of the relay, securely attached thereto in a manner to prevent any movement between the relay and the mounting bracket.

3.4.7 Terminals (see 3.1). Terminals shall be as specified herein. Manufacturer may supply hot solder dipped terminals provided that the hot solder dipping process has been approved by the qualifying activity and when specified on the individual order (see 6.2.1a). Solder dipped terminals may be .002 inch (0.05 mm) larger than the maximum dimension specified (see 3.1). Icicles are a normal result of the hot solder dip process and shall not be grounds for rejection (see figure 2).

NOTES:

1. No solder is allowed on the header surface. Components (relay terminals) after solder-dip shall be capable

of meeting method 208 of MIL-STD-202 , solderability requirements.

2. Solder-coat thickness shall be .0001 inch (.003 mm) minimum.

FIGURE 2. Solder-dip acceptability criteria (solder-icicle length limits).