MIL-PRF-28776F
6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are,
at the time of award of contract, qualified for inclusion in Qualified Products List QPL No. 28776 whether or not such
products have actually been so listed by that date. The attention of the contractors is called to these requirements,
and manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government
tested for qualification in order that they may be eligible to be awarded contracts or orders for the products covered
by this specification. Information pertaining to qualification of products may be obtained from (Passive Devices
Team, P.O. Box 3990, Columbus, OH 43218-3990, vqp.arw@dla.mil or vqp.kr@dla.mil). An online listing of products
qualified to this specification may be found in the Qualified Products Database (QPD) at https://assist.dla.mil.
6.3.1 Qualification and maintenance by similarity. This information is for reference only. Refer to the individual
specification sheets for detailed information.
6.3.1.1 Qualification by similarity. The graphic guide shown illustrates the relative complexity of individual
specification sheets within a style group for use in determining qualification inspection (reduced testing) candidate
specification sheets. Arrow direction indicates flow towards less complex designs. Asterisk indicates most complex
design of style group.
T0-5, round pin pattern:
0.100 grid pin pattern:
*/3 ------------> /4 ------------> /5
*/7 ------------> /6
|
----> /1
6.3.1.2 Maintenance by similarity. The information accumulated for the style groups listed below may be
combined for group B and C inspections maintenance and extension of failure rate levels in accordance with MIL-
STD-690. Testing samples must be representative of production. Maintenance plan is contingent upon qualifying
activity approval. Failures exceeding the sampling plan selected (C = number), regardless of the specific
specification sheet affected, affect all other specification sheets within the respective style group.
a.
T0-5, round pin pattern: /1, /3, /4, /5.
b.
0.100, grid pin pattern: /6, /7.
6.4 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker
growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can
develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top
of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have
shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard
Specification for Electrodeposited Coatings of Tin).
6.5 PIN. This specification requires a PIN that describes codification and/or classification and appropriate
6.6 Sealing. The following procedure is suggested as a guide; however, every effort should be made to utilize the
most effective procedure consistent with the state of the art.
a.
Evacuate to less than 200 microns.
b.
Heat to maximum rated ambient temperature with continued evacuation (see 3.1).
c.
Maintain heat and vacuum for 12 hours or longer, continuing the treatment until a maximum pressure of 80
microns is reached.
d.
Turn off heaters and maintain pressure for 4 hours.
e.
Close evacuation valve and fill chamber with the desired pressurizing gas.
f.
Seal relay before removing from chamber.
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